Recently, it has been reported that low-melting-point alloy (LMPA) are used in thermal management materials, which has greatly attracted the attention of researchers due to their excellent thermal conductivity and electrical conductivity. However, there is rare report on how to construct the segregated structure of the LMPA network in the polymer matrix for more efficiently improving its thermal conductivity. Here, the polyetherimide/SnBi₁₇Cu_0.5 LMPA (PEI/SBC) composites with segregated structure were obtained which SnBi₁₇Cu_0.5 particles enclosed by PEI microspheres were interconnected forming a continuous network structure. Therefore, the PEI/SBC composites with 50 vol% SBC had a satisfied thermal conductivity of 1.26 Wm^-1K⁻¹. The influence factors on the LMPA segregated structure were systematically investigated. It showed that hot-processing temperature and size of the LMPA particles determined the formation of segregated structure. Besides, the small size of the PEI microspheres was favor of the densification of polymer matrix.

近年来，据报道，低熔点合金（LMPA）被用于热管理材料中，由于其优异的导热性和导电性，极大地引起了研究者的关注。但是，关于如何在聚合物基质中构建LMPA网络的隔离结构以更有效地提高其导热系数的报道很少。在此，获得了具有分离结构的聚醚酰亚胺/ SnBi ₁₇ Cu _0.5 LMPA（PEI / SBC）复合材料，其中被PEI微球包裹的SnBi ₁₇ Cu _0.5颗粒相互连接形成连续的网络结构。因此，SBC含量为50％（体积）的PEI / SBC复合材料的导热系数为1.26 Wm^-1 K ^-1。系统研究了影响LMPA偏析结构的因素。结果表明，LMPA颗粒的热处理温度和尺寸决定了偏析结构的形成。此外，PEI微球的小尺寸有利于聚合物基质的致密化。