It is my pleasure to announce the TDMR community the appointment of Dr. Karumbu N. Meyyappan as Editor of TDMR. Dr. Meyyappan is an expert on Interconnects, BGA, Sockets/Connectors, Substrate Technologies, Board Technologies. Dr. Meyyappan received the Ph.D. degree from the University of Maryland at College (Microelectronic Packaging—Mechanical Engineering). He has a large industry experience with Intel as a Senior Staff Reliability Engineer, where he is involved in multiple failure modes in silicon far back end involving multimillion degree of freedom, and predicting micromotions between contact interfaces on complex server systems/racks. We are sure Dr. Meyyappan will be of great value for reinforcing the technical quality of TDMR.

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2020 年 12 月社论


我很高兴地宣布 TDMR 社区任命 Karumbu N. Meyyappan 博士为 TDMR 编辑。 Meyyappan 博士是互连、BGA、插座/连接器、基板技术、电路板技术方面的专家。 Meyyappan 博士获得博士学位。马里兰大学学院博士学位（微电子封装—机械工程）。他在英特尔担任高级可靠性工程师，拥有丰富的行业经验，参与涉及数百万自由度的硅远端的多种故障模式，并预测复杂服务器系统/机架上接触接口之间的微运动。我们确信 Meyyappan 博士对于加强 TDMR 的技术质量将具有巨大的价值。