Evaluation of the Quality of Solder Joints within Silicon Solar Modules Using Magnetic Field Imaging,Physica Status Solidi (A) - Applications and Materials Science

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Evaluation of the Quality of Solder Joints within Silicon Solar Modules Using Magnetic Field Imaging
Physica Status Solidi (A) - Applications and Materials Science Pub Date : 2020-12-11 , DOI: 10.1002/pssa.202000292
Kai Kaufmann ₁ , Dominik Lausch ₁ , Chia-Mei Lin ₁ , Maik Rudolph ₁ , Daniel Hahn ₁ , Markus Patzold ₁

Affiliation

Solar cells and modules are already a mature technology in mass production. It is critical to optimize and to systematically monitor their performance. The introduction of automated soldering processes and the increasing usage of novel contacting schemes can cause harmful defects, e.g., missing and defective contacts, and, thus, affect the electrical performance of solar modules after production or in field usages. Herein, magnetic field imaging (MFI) is utilized to do a non‐destructive, quantitative analysis of the modules to investigate the quality of the soldering contacts. In detail, the cross connector, interconnector, and rear‐side pads are investigated. The typical in‐field observed defects are presented. For the first time, the quality of rear‐side pads under operation is studied in detail. It is shown that 1) directly after production, the current conduction takes place not only via the rear pads but also via the press‐on contact between the bare aluminum and the rear‐side ribbons; 2) an off‐centered ribbon on the pad leads to abnormal current distribution; and 3) single rear‐side pad breaks as a function of thermal cycles due to thermo‐mechanical stress.

中文翻译：

使用磁场成像评估硅太阳能电池组件中焊点的质量

太阳能电池和组件已经是大规模生产中的成熟技术。优化并系统地监视其性能至关重要。自动化焊接工艺的引入以及新颖的接触方案的不断使用会导致有害的缺陷，例如接触的缺失和缺陷，从而影响生产后或现场使用的太阳能电池组件的电性能。本文中，磁场成像（MFI）用于对模块进行无损定量分析，以研究焊接触点的质量。详细地，研究了交叉连接器，互连器和背面焊盘。介绍了典型的现场观察到的缺陷。首次详细研究了操作中的后侧垫的质量。结果表明：1）直接生产后，电流的传导不仅通过后垫，而且还通过裸铝和背面碳带之间的压接实现。2）焊盘上的偏心色带导致异常电流分布；和3）由于热机械应力，单个后侧垫板断裂是热循环的函数。

更新日期：2020-12-11

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