Abstract High thermal conductivity and high flexibility, required by advanced microelectronic devices, are hard to be combined in composites, because their dependences on components concentration often contradict each other. Here, the conflicting goals are achieved by preparing meter-level BN paper containing 82.6 wt% commercial micron BN sheets with dihydromyricetin (DMY) from herbal medicine as a novel surface modifier and high molecular weight acrylate copolymer as adhesive. Thanks to the polycyclic aromatic hydrocarbons of DMY coupled with abundant functional groups, which form conjugation with the inert BN and increase its hydrophilicity, tough interphases are established in the oriented nacre-like BN composite architecture when Mayer rod method is used. The resultant BN paper can be folded into complicated shapes, possessing decent tensile properties (strength = 8.49 MPa; failure strain = 3.8%), as well as excellent in-plane and through-plane thermal conductivities (8.97 and 2.14 W m−1 K−1). Besides, the DMY attached to BN sheets can further coordinate with Pd2+, catalyzing copper deposition and producing flexible copper-clad BN paper. Considering the cost-effective and easy-accessible raw materials and the simple assembly technique, which avoid the limitation of lab-scale BN nano-sheets, the present approach may be feasible for producing flexible electronic components with highly efficient thermal dissipation ability.

中文翻译：

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通过简便且可扩展的方法制造的高导热性、优异的柔性和表面可金属化的氮化硼纸

摘要 先进微电子器件所要求的高导热性和高柔韧性很难结合在复合材料中，因为它们对成分浓度的依赖往往相互矛盾。在这里，相互矛盾的目标是通过制备含有 82.6 wt% 商业微米 BN 片的米级 BN 纸实现的，其中来自草药的二氢杨梅素 (DMY) 作为新型表面改性剂，高分子量丙烯酸酯共聚物作为粘合剂。由于 DMY 的多环芳烃与丰富的官能团结合，与惰性 BN 形成共轭并增加其亲水性，当使用 Mayer 棒法时，在定向的珍珠层状 BN 复合结构中建立了坚韧的界面。得到的BN纸可以折叠成复杂的形状，具有良好的拉伸性能（强度 = 8.49 MPa；破坏应变 = 3.8%），以及出色的面内和面内热导率（8.97 和 2.14 W m-1 K-1）。此外，附着在 BN 片上的 DMY 可以进一步与 Pd2+ 配合，催化铜沉积并生产柔性镀铜 BN 纸。考虑到成本效益高且易于获取的原材料和简单的组装技术，避免了实验室规模的 BN 纳米片的局限性，本方法可能适用于生产具有高效散热能力的柔性电子元件。催化铜沉积并生产柔性包铜BN纸。考虑到成本效益高且易于获取的原材料和简单的组装技术，避免了实验室规模的 BN 纳米片的局限性，本方法可能适用于生产具有高效散热能力的柔性电子元件。催化铜沉积并生产柔性包铜BN纸。考虑到成本效益高且易于获取的原材料和简单的组装技术，避免了实验室规模的 BN 纳米片的局限性，本方法可能适用于生产具有高效散热能力的柔性电子元件。