In this work, SiC nanowires (SiC NWs) reinforced SBG (Sn-58Bi-0.05GNSs) composite solder was prepared using powder metallurgy route. The effect of SiC NWs on melting temperature, wetting behavior, shear properties, microstructure of the prepared solder joints and interfacial reaction were studied in detail. Results reveal that incorporating SiC NWs can develop the wetting behavior and shear properties of solder joint but has a little effect on melting temperature. The microstructure of solder is refined markedly with the addition of SiC NWs, which is one of the reasons for the increase in the shear strength of the solder joints. Additionally, the dimension of Cu6Sn5 IMC grains diminishes with the doping of SiC NWs, which resulted in the thinning of Cu6Sn5 IMC layer. Thence, the addition of SiC NWs may be an effective way to improve the reliability of solder joints.

中文翻译：

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SiC纳米线对Sn58Bi-0.05GNSs/Cu焊点可靠性的影响

本工作采用粉末冶金法制备了碳化硅纳米线（SiC NWs）增强SBG（Sn-58Bi-0.05GNSs）复合焊料。详细研究了碳化硅纳米线对熔化温度、润湿行为、剪切性能、所制备焊点的微观结构和界面反应的影响。结果表明，加入 SiC NW 可以提高焊点的润湿行为和剪切性能，但对熔化温度影响不大。SiC NWs的加入显着细化了焊料的微观结构，这是提高焊点剪切强度的原因之一。此外，Cu 的尺寸6锡5IMC晶粒随着SiC NWs的掺杂而减少，导致Cu变薄6锡5IMC 层。因此，添加 SiC NW 可能是提高焊点可靠性的有效方法。