Abstract

Temperature uniformity is an important factor in the thermal management of electronic devices. The present study investigates the effect of bypass injection on the wall temperature distribution of a single-phase mini/micro-channel using water as the coolant. Experimental studies were conducted on an 18 mm thick copper substrate heated by a cartridge heater, with the bypass inlet located midway between the channel inlet and outlet. After validating the numerical results with the experimental data, simulations were carried out on a 1 mm thin copper and silicon substrates with uniform and non-uniform heat flux conditions on the back of the substrate, for two different locations of bypass injection. Results for thin copper and silicon substrates with uniform heat flux condition indicate that the bypass injection helps in reducing the difference between the maximum and minimum local wall temperatures by up to 60% and 76% for silicon and copper substrates, respectively. The reduction is higher for the bypass injection located midway between the channel inlet and outlet compared to the injection located at one-fourth of the channel length from the inlet. Bypass injection is found to be beneficial for the non-uniform (step change) heat flux condition, with the higher heat flux over the second half of the channel length. The experimental and numerical results for the thick copper substrate show a near-uniform wall temperature distribution even without bypass injection.

摘要

温度均匀性是电子设备热管理的重要因素。本研究研究了旁路注入对使用水作为冷却剂的单相微型/微通道壁温分布的影响。实验研究是通过盒式加热器加热的18毫米厚铜基板进行的，旁路入口位于通道入口和出口之间的中间。在用实验数据验证了数值结果之后，在两个不同位置的旁路注入条件下，在具有均匀和不均匀热通量条件的1 mm薄铜和硅基板上进行了仿真。具有均匀热通量条件的薄铜和硅基板的结果表明，旁路注入有助于分别将硅和铜基板的最大和最小局部壁温之差分别降低多达60％和76％。与位于通道入口和出口之间通道长度的四分之一处的喷射相比，位于通道入口和出口之间的中间喷射的减少量更大。发现旁路注入对于不均匀（阶跃变化）的热通量条件是有益的，在通道长度的后半部分具有较高的热通量。即使没有旁路注入，厚铜基板的实验和数值结果也显示出近乎均匀的壁温分布。