A half-air-filled substrate-integrated groove-gap waveguide is proposed for millimeter-wave and terahertz applications. The waveguide is constructed by a ball grid array using a flip-chip technique without metallic vias with lightweight and low profile. The possible leakage perpendicular to the groove is prevented by solder balls as modeled by an equivalent circuit. Besides, an inline transition between the proposed waveguide and a microstrip line is proposed, fabricated, and measured. The design concept and working mechanism are explained. Good agreement between simulation and measurement is observed. The simulation shows that the proposed waveguide can cover the entire ${W}$ -band (70–118 GHz), and the measurement demonstrates that the proposed transition can operate at 90–98.8 GHz.

中文翻译：

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基于半空气填充球栅阵列的基板集成槽隙波导及其在 W 波段向微带线的过渡

提出了一种用于毫米波和太赫兹应用的半充气基板集成槽隙波导。波导由球栅阵列使用倒装芯片技术构建而成，没有金属通孔，重量轻且薄。通过等效电路建模的焊球防止垂直于凹槽的可能泄漏。此外，提出、制造和测量了所提出的波导和微带线之间的内联过渡。阐述了设计理念和工作机制。观察到模拟和测量之间的良好一致性。仿真表明，所提出的波导可以覆盖整个 ${W}$ 频带（70-118 GHz），并且测量表明所提出的过渡可以在 90-98.8 GHz 下运行。