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Damage quantification of 3D-printed structure based on composite multiscale cross-sample entropy
Smart Materials and Structures ( IF 3.7 ) Pub Date : 2020-12-05 , DOI: 10.1088/1361-665x/abbb14
Tzu-Kang Lin , Ting-Hsuan Huang

This study combined three-dimensional (3D) printing and composite multiscale cross-sample entropy (CMSCE) in structural health monitoring (SHM) and explored a quantification criterion for single-story structural damage index (DI). By quantifying the DI, the study established a SHM system suitable for real-world structures. A numerical model of a seven-story 3D printed structure was first created. Through the establishment of various bracing conditions as failure modes, damage to the structure was simulated properly, and CMSCE was used to effectively indicate the location of damage. Moreover, the DI was used to shorten the assessment time and improve system accuracy. The DI quantification facilitated observation of the effects of various degrees of damage on the analysis results. Based on the results, an experiment involving a 3D-printed structure was conceived. First, an experiment involving a seven-story structure with severe, moderate, and marginal single-story damage was conducted. The signals obtained from these structures were used to perform CMSCE analysis. Structural damage was detected using entropy curves and DI figures to determine the location and degree of damage as well as to quantify the DI. Thus, the study developed a reliable method by combining emerging 3D printing technology with the CMSCE DI to explore the feasibility of practical application.



中文翻译:

基于复合多尺度交叉样本熵的3D打印结构损伤量化

这项研究结合三维(3D)打印和复合多尺度交叉样本熵(CMSCE)进行结构健康监测(SHM),并探索了单层结构破坏指数(DI)的量化标准。通过量化DI,该研究建立了适用于实际结构的SHM系统。首先创建了一个七层3D打印结构的数值模型。通过建立各种支撑条件作为破坏模式,对结构的损伤进行了正确的模拟,并使用CMSCE来有效指示损伤的位置。此外,DI用于缩短评估时间并提高系统精度。DI量化有助于观察各种程度的损伤对分析结果的影响。根据结果​​,构思了涉及3D打印结构的实验。首先,进行了涉及七层结构的实验,该结构具有严重,中度和边缘性的单层破坏。从这些结构获得的信号用于执行CMSCE分析。使用熵曲线和DI数字检测结构损坏,以确定损坏的位置和程度以及量化DI。因此,该研究通过将新兴的3D打印技术与CMSCE DI结合起来,开发了一种可靠的方法,以探索实际应用的可行性。使用熵曲线和DI数字检测结构损坏,以确定损坏的位置和程度以及量化DI。因此,该研究通过将新兴的3D打印技术与CMSCE DI结合起来,开发了一种可靠的方法,以探索实际应用的可行性。使用熵曲线和DI数字检测结构损坏,以确定损坏的位置和程度以及量化DI。因此,该研究通过将新兴的3D打印技术与CMSCE DI结合起来,开发了一种可靠的方法,以探索实际应用的可行性。

更新日期:2020-12-05
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