Chip solder degradation is one of the main factors affecting the reliable operation of insulated gate bipolar transistor (IGBT) modules. However, there are still many challenges to get the real lifetime of chip solder. This paper proposes a lifetime consumption prediction method based on chip solder failure. First, the constant high junction temperature fluctuations are applied to IGBT modules for the power cycling tests. The transient thermal resistance is measured to monitor the degradation process of IGBT modules for every 1000 times of aging tests. And the failure degree of chip solder is analyzed by the integral structure function. With the help of scanning acoustic microscope, the failure analysis of aging modules is carried out. The finite element simulation model is established to analyze the transient thermomechanical characteristics of chip solder. Then, the influences of different power cycling conditions on the viscoplastic strain of chip solder are analyzed quantitatively. The average value of the viscoplastic strain increment is obtained by the integral method under large thermal loading. Meanwhile, the method is also applicable to the low thermal loading. Finally, a study case of IGBT modules in a 1.5 MW grid‐side wind power converter is given to demonstrate the validity of the proposed method. © 2020 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.

中文翻译：

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IGBT中芯片焊锡疲劳的预测

芯片焊料的降解是影响绝缘栅双极晶体管（IGBT）模块可靠运行的主要因素之一。然而，要获得芯片焊料的真实寿命，仍然存在许多挑战。提出了一种基于芯片焊接失效的寿命消耗预测方法。首先，将恒定的高结温波动应用于IGBT模块，以进行功率循环测试。每进行1000次老化测试，就测量瞬态热阻以监控IGBT模块的退化过程。并通过积分结构函数分析了片状焊料的失效程度。借助扫描声显微镜，对老化模块进行故障分析。建立了有限元仿真模型，以分析芯片焊料的瞬态热机械特性。然后，定量分析了不同功率循环条件对片状焊料粘塑性应变的影响。在大的热负荷下，通过积分法求出粘塑性应变增量的平均值。同时，该方法也适用于低热负荷。最后，以一个1.5 MW并网风电变流器中IGBT模块的研究案例为例，证明了该方法的有效性。©2020日本电气工程师学会。由Wiley Periodicals LLC发布。在大的热负荷下，通过积分法求出粘塑性应变增量的平均值。同时，该方法也适用于低热负荷。最后，以一个1.5 MW并网风电变流器中IGBT模块的研究案例为例，证明了该方法的有效性。©2020日本电气工程师学会。由Wiley Periodicals LLC发布。在大的热负荷下，通过积分法求出粘塑性应变增量的平均值。同时，该方法也适用于低热负荷。最后，以一个1.5 MW并网风电变流器中IGBT模块的研究案例为例，证明了该方法的有效性。©2020日本电气工程师学会。由Wiley Periodicals LLC发布。