This letter discusses the design, manufacture, and characterization of a substrate‐integrated waveguide E‐plane tapering. The tapering facilitates the integration of two waveguides with varying heights for, that is, conductor‐backed coplanar waveguide to rectangular waveguide integration. A simultaneous top‐ and bottom‐sided, λ/4‐based stepped tapering for the 71–86 GHz band is designed using low‐temperature co‐fired ceramic technology. The fabricated design is measured using two E‐plane taperings in back‐to‐back configuration. The reflection coefficient better than −11.8 dB, and the transmission coefficient larger than −1.4 dB at the full 71–86‐GHz range for a single tapering is extracted from the measurement using time‐gating.

中文翻译：

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低温共烧陶瓷中的基片集成波导E平面渐细

这封信讨论了基片集成波导E面逐渐变细的设计，制造和特性。逐渐变细有助于两个高度不同的波导的集成，即将导体支持的共面波导与矩形波导集成在一起。使用低温共烧陶瓷技术设计了用于71–86 GHz频带的同时基于λ/ 4的顶侧和底侧阶梯形锥度。使用两个背对背配置的E平面渐缩线来测量制造的设计。使用时间门控从测量中提取出在单锥度的整个71–86 GHz范围内，反射系数优于-11.8 dB，传输系数大于−1.4 dB。