In this article, vertical interconnection implemented as capacitive-based chip-to-chip differential signaling offers crosstalk noise reduction in three-dimensional (3-D) die stacking. To investigate the effects of signal transmission reliability on the 3-D stacked die structure, this article aims at providing the parametric models. The signal and noise properties of capacitively coupled channels are studied using a 3-D electromagnetic field solver to extract the mixed-mode scattering parameters of the differential signal pads. Corner differential arrangements are considered, and their abilities to reject noise are investigated through the proposed parametric models. The exponential decay and generalized exponential decay models are formulated and estimated with the simulated data to assess the transmission quality of the signal. It is observed that there is a nonlinear pattern of the signal-to-noise ratio values related to differential frequency responses for the given pad overlap and the pitch size. The performances of the two models are compared through the root-mean-square error and the mean absolute percentage error for sample fitting as well as for extrapolation prediction. The characteristics of the generalized exponential decay models are also presented and illustrated. The proposed design methodology can be applied to expedite the optimized implementation of capacitive coupling interconnection for a specific operating frequency band.

中文翻译：

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具有可靠无线连接的堆叠芯片封装的布局设计

在本文中，作为基于电容的芯片到芯片差分信号实现的垂直互连可在三维 (3-D) 芯片堆叠中降低串扰噪声。为了研究信号传输可靠性对 3D 堆叠芯片结构的影响，本文旨在提供参数模型。使用 3-D 电磁场求解器来研究电容耦合通道的信号和噪声特性，以提取差分信号焊盘的混合模式散射参数。考虑了角差分布置，并通过提出的参数模型研究了它们抑制噪声的能力。指数衰减和广义指数衰减模型是用模拟数据制定和估计的，以评估信号的传输质量。据观察，对于给定的焊盘重叠和间距大小，存在与差分频率响应相关的信噪比值的非线性模式。通过样本拟合以及外推预测的均方根误差和平均绝对百分比误差来比较两种模型的性能。还介绍和说明了广义指数衰减模型的特征。所提出的设计方法可用于加速针对特定工作频段的电容耦合互连的优化实施。通过样本拟合以及外推预测的均方根误差和平均绝对百分比误差来比较两种模型的性能。还介绍和说明了广义指数衰减模型的特征。所提出的设计方法可用于加速针对特定工作频段的电容耦合互连的优化实施。通过样本拟合以及外推预测的均方根误差和平均绝对百分比误差来比较两种模型的性能。还介绍和说明了广义指数衰减模型的特征。所提出的设计方法可用于加速针对特定工作频段的电容耦合互连的优化实施。