Organic residues (compost) can be used as growth medium but may contain phytotoxic ions that, combined with a water deficit may alter the behavior of plants. The experiment was carried out in a growth chamber with Cistus albidus in a commercial substrate, C (sphagnum peat, coconut fiber and perlite, 8:7:1) and a mixture of compost substrates, Cp (slurry compost, coconut fiber and perlite, 3:6:1). Plants were grown in pots under well-watered, maintaining values of Ψ_l around −0.9 MPa (WW) and water-stressed (WS) conditions, where the irrigation was removed until reached values of Ψ_l around −3.0 MPa (water stress period), after then, water was re-established in all plants (recovery period). Although, the well-watered plants had a leaf water potential (Ψ_l) around −0.9 MPa, stomatal conductance (g_s) was 125 mmol m⁻²s⁻¹ in the commercial substrate and 30 mmol m⁻²s-1 in compost. The time taken to reach the threshold value at which water stress occurs was 13 days in the commercial substrate and 53 days in compost. Water-stressed plants in the commercial substrate had significantly lower values of Ψ_l and g_s than well-watered. Plants in compost maintained values of g_s similar in both irrigation treatments (WW and WS) and accumulated less biomass than those that grown in commercial. The water stress in compost led an increase in the adaxial epidermis, parenchyma and mesophyll, whereas water stress in commercial the proportions of the different tissues decreased. Higher lipid peroxidation values were found in plants grown in both substrates under water stress. The recovery time of the plants, until manage Ψ_l values around −0.9 MPa, depended on the type of substrate. The restoration of irrigation in commercial substrate act as a new stress, as reflected in the photochemical mechanisms.

有机残留物（堆肥）可用作生长培养基，但可能含有植物毒性离子，再加上水分不足可能会改变植物的行为。实验是在生长室中进行的，在商业基质中使用Cistus albidus，基质为C（泥炭泥炭，椰子纤维和珍珠岩，8：7：1），混合肥料基质为Cp（浆状堆肥，椰子纤维和珍珠岩）， 3：6：1）。植物在花盆下充分浇水中生长，维持Ψ的值_升左右-0.9兆帕（WW）和水胁迫（WS）的条件下，其中，除去灌溉直至达到Ψ的值_升左右-3.0兆帕（水分胁迫期间）之后，所有植物都恢复了水分（恢复期）。尽管浇水良好的植物具有叶片水势（Ψ_l）在-0.9 MPa附近，商品基质中的气孔电导（g _s）为125 mmol m ^-2 s ^-1，堆肥中的气孔电导为30 mmol m ^-2 s-1。在商业基质中，达到发生水分胁迫的阈值所需的时间为13天，而堆肥为53天。商业基质中水分胁迫的植物_的than _l和g _s值明显低于灌溉良好的植物。堆肥中的植物保持g _s的值在两种灌溉方式（WW和WS）中都相似，并且积累的生物量少于商业化生产的生物量。堆肥中的水分胁迫导致近表皮，薄壁组织和叶肉的增加，而商业化胁迫中不同组织的比例降低。在水分胁迫下两种基质中生长的植物中发现较高的脂质过氧化值。植物的恢复时间，直到大约－0.9 MPa左右的_{l l}值，取决于基质的类型。光化学机理反映出，商业基质中灌溉的恢复是一种新的压力。