The MALTA monolithic silicon pixel sensors have been used to study dicing and thinning of monolithic silicon pixel detectors for large area and low mass modules. Dicing as close as possible to the active circuitry will allow to build modules with very narrow inactive regions between the sensors. Inactive edge regions of less than $5\mathrm{\mu }$ m to the electronic circuitry could be achieved for $100\mathrm{\mu }$m thick sensors. The MALTA chip (Cardella et al., 2019) also offers the possibility to transfer data and power directly from chip to chip. Tests have been carried out connecting two MALTA chips directly using ultrasonic wedge wire bonding. Results from lab tests show that the data accumulated in one chip can be transferred via the second chip to the readout system, without the need of a flexible circuit to route the signals. The concept of chip to chip data and power transfer to achieve low mass modules has also been studied on prototype wafers using Cu-stud interconnection bridges. First results are presented, outlining technical challenges and possible future steps to achieve a low mass large area monolithic pixel sensor module.

MALTA单片硅像素传感器已用于研究大面积和低质量模块的单片硅像素检测器的切割和减薄。尽可能靠近有源电路进行切割，将允许构建传感器之间的非活动区域非常狭窄的模块。无效边缘区域小于$5\mathrm{\mu }$ 可以实现电子电路的 $100\mathrm{\mu }$米厚的传感器。MALTA芯片（Cardella等，2019）还提供了在芯片之间直接传输数据和电源的可能性。已经进行了使用超声波楔形丝焊直接连接两个MALTA芯片的测试。实验室测试的结果表明，一个芯片中积累的数据可以通过第二个芯片传输到读出系统，而无需使用灵活的电路来路由信号。芯片间数据和功率传输以实现低质量模块的概念也已在使用Cu-stud互连桥的原型晶圆上进行了研究。给出了初步结果，概述了实现低质量大面积单片像素传感器模块的技术挑战和可能的未来步骤。