In this paper results of calibration of Analog Devices AD5933 chip for damage detection problems based on electromechanical impedance (EMI) are presented. A simple calibration method using mid-frequency point and resistor with known resistance was utilised. Authors investigated the influence of calibration process on the measurement results and its agreement with professional measurement equipment. Results obtained from AD5933 were compared with results obtained by professional impedance analyser HIOKI IM3570. Moreover, the influence of lack and wrong calibration of the AD5933 chip is presented. Calibration was validated for the case of damage detection in the carbon fibre reinforced polymer CFRP panel with delamination. Damage indices in the form of RMSD and CCD were utilised. Influence of changing temperature was also included and compensated. Good agreement of results from AD5933 and HIOKI IM3570 was achieved in the case of EMI spectra as well as calculated damage indices. The EMI spectra of magnitude of impedance, phase angle, resistance, conductance, reactance and susceptance were investigated. The obtained results pave the way for effective employment of the AD5933 chip for damage assessment in composite structures.

本文介绍了针对基于机电阻抗（EMI）的损坏检测问题对Analog Devices AD5933芯片进行校准的结果。利用中频点和电阻已知的简单校准方法。作者研究了校准过程对测量结果的影响及其与专业测量设备的一致性。将AD5933的结果与专业阻抗分析仪HIOKI IM3570的结果进行比较。此外，还介绍了AD5933芯片缺少和校准错误的影响。在分层的碳纤维增强聚合物CFRP面板中，针对损坏检测的情况对校准进行了验证。采用了RMSD和CCD形式的损坏指数。温度变化的影响也包括在内并予以补偿。在EMI谱以及计算得出的损坏指数的情况下，AD5933和HIOKI IM3570的结果取得了很好的一致性。研究了EMI谱的阻抗，相角，电阻，电导，电抗和电纳的大小。获得的结果为有效利用AD5933芯片进行复合结构损伤评估铺平了道路。