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Fabrication of microgrooves with secondary microstructures by electrical discharge machining using a functionally graded laminated electrode
Journal of Micromechanics and Microengineering ( IF 2.4 ) Pub Date : 2020-12-01 , DOI: 10.1088/1361-6439/abc96d
Zhiwen Zhou 1 , Xiaoyu Wu 1 , Jianguo Lei 1 , Zuohuan Hu 2 , Guoli Gao 2 , Yong Tang 1 , Chuntao Chang 3
Affiliation  

As tool electrodes of different materials have distinct electrical discharge machining (EDM) wear rates, this paper proposed a method for fabricating a surface microstructure by EDM with a laminated electrode including a functionally graded material foil. The preparation of functionally graded CuSn foils and the formation of a functionally graded laminated electrode (FGLE) were studied. Additionally, the effects of the electrical parameters and thermal diffusion temperature on the EDM results were explored. The experimental results show that after treatment with thermal diffusion at a temperature of 500 C for 10 h, a Sn-plated Cu foil was transformed into a functionally graded CuSn foil in which the distribution of Sn was helpful to the generation of a secondary microstructure on the workpiece. After four rounds of wear-variation EDM with positive polarity under a machining voltage 200 V, a pulse width 1 μs, and a pulse interval 10 μs, a FGLE blank made of functionally graded CuSn foil and Cu foils produced a stable working surface profile. Based on the optimized process parameters, a microgroove array, a width of 370 μm and a depth of 360 μm, and complex surface microstructures were fabricated on the #304 stainless steel workpieces, each microgroove has a 75 μm high secondary microstructure.



中文翻译:

使用功能梯度层压电极通过放电加工制造具有次级微结构的微槽

由于不同材料的工具电极具有不同的放电加工(EDM)磨损率,因此本文提出了一种通过EDM用包括功能梯度材料箔的层压电极制造表面微结构的方法。研究了功能梯度CuSn箔的制备和功能梯度层压电极(FGLE)的形成。此外,还探讨了电参数和热扩散温度对EDM结果的影响。实验结果表明,在500℃的温度下进行10h的热扩散处理后,镀锡的铜箔转变为功能梯度的CuSn箔,其中Sn的分布有助于在表面上生成次级微观结构。工件。μ s和间隔10的脉冲μ S,制成功能梯度的CuSn箔和Cu箔的FGLE坯件制造稳定的工作表面轮廓。基于优化的工艺参数,一个微槽阵列,370的宽度μ m和360的深度μ m和复杂的表面微观结构上的#304不锈钢工件被制造,每个微槽具有75 μ m高的二次微结构。

更新日期:2020-12-01
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