Abstract

Boriding is a method used to increase the biocompatibility and strength of metallic materials. However, by this time, no study has been encountered in the literature regarding investigation of the effects of boriding on metal-ceramic bond strength of Co–Cr alloy fabricated by selective laser melting. Boriding of metallic surfaces may be an alternative to increase the roughness and adhesion strength of the metal surface. The aim of this study was to analyze the effects of boriding on the metal-ceramic bond strength of a Co–Cr alloy fabricated by selective laser melting. In this study, metal substructures of 0.1 mm, 0.2 mm and 0.3 mm thickness values were produced from CoCrW powders with the method of selective laser melting, borided at 900 °C for 1 h and coated with porcelain. After the procedures, the effects of the boriding process on metal-porcelain bonding were determined by in vitro fracture tests. The 0.1 mm 900 °C 1 h (521.22 ± 56.37 N), (p < 0.001), 0.2 mm 900 °C 1 h (619.55 ± 20.94 N), (p = 0.051) and 0.3 mm 900 °C 1 h (592.11 ± 260.58 N) specimens showed the highest bond strength, significantly higher than that of the 0.1 mm Untreated (299.88 ± 61.56 N), 0.2 mm Untreated (480.55 ± 11.87 N) and 0.3 mm Untreated (520.00 ± 165.52 N), (p = 0.29) specimens. According to the results, with the help of the boriding process applied on the surfaces of the metal substructure samples, the bonding resistance of the porcelain applied onto the metal substructures increased by approximately 74, 29 and 14% in comparison to the samples that were not borided respectively for the thicknesses of 0.1, 0.2 and 0.3 mm. Boriding of metallic surfaces increased the bond strength of the metal material with ceramics.

摘要

硼化是一种用于提高金属材料的生物相容性和强度的方法。然而，到目前为止，在文献中还没有关于硼化对选择性激光熔化制造的 Co-Cr 合金金属-陶瓷结合强度影响的研究。金属表面的硼化可能是增加金属表面粗糙度和粘附强度的替代方法。本研究的目的是分析硼化对选择性激光熔化制造的 Co-Cr 合金金属-陶瓷结合强度的影响。在这项研究中，采用选择性激光熔化的方法，将 CoCrW 粉末制成 0.1 mm、0.2 mm 和 0.3 mm 厚度值的金属亚结构，在 900 °C 下硼化 1 小时并涂上瓷。办完手续后，体外断裂试验。0.1 mm 900 °C 1 h (521.22 ± 56.37 N)、( p  < 0.001)、0.2 mm 900 °C 1 h (619.55 ± 20.94 N)、( p  = 0.051) 和 0.3 mm 1 h ( p < 0.001) ±260.58 N）试样显示出最高的粘合强度，比的0.1毫米未处理（299.88±61.56 N）为0.2mm未处理（480.55±11.87 N）至0.3mm未处理（520.00±165.52 N），（显著更高p = 0.29) 标本。结果表明，在金属亚结构样品表面进行渗硼处理后，与未未处理的样品相比，在金属亚结构上涂覆的瓷的结合电阻分别提高了约 74%、29% 和 14%。分别对 0.1、0.2 和 0.3 mm 的厚度进行硼化处理。金属表面的硼化增加了金属材料与陶瓷的结合强度。