A new series of high thermal boron nitride (BN) composites are prepared and characterized by several techniques. They are formed by an epoxy‐anhydride matrix and different BN contents, ranging from 30 to 80 wt%, of 120 μm agglomerates. For high BN ratio (≥60 wt%), epoxy mixtures were compressed (75 MPa) during 1 minute before curing, eliminating voids due to the high increase of viscosity, improving the compactness of the material and enhancing the thermal conductivity (TC). The curing process evolution was studied by calorimetric measurements to see if there was an influence of the filler on the curing rate. Rheological tests were performed to obtain the percolation threshold. It was observed that BN filler did not affect negatively the thermomechanical properties of the materials and allowed to enhance the TC from 0.17 W/m K in the case of the neat epoxy, to 3.06 W/m K when 80 wt% of BN agglomerates were added, which represents an improvement of 1700%.

中文翻译：

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新型BN-环氧/酸酐复合材料具有增强的导热性

制备了一系列新的高热氮化硼（BN）复合材料，并通过多种技术对其进行了表征。它们由环氧酸酐基质和不同的BN含量（120微米的附聚物）组成，含量从30到80 wt％不等。对于高BN比（≥60 wt％），在固化前1分钟内将环氧混合物压缩（75 MPa），消除了由于粘度的高增加而导致的空隙，提高了材料的致密性并提高了导热系数（TC）。通过量热法研究固化过程的演变，以查看填料是否对固化速率产生影响。进行流变测试以获得渗滤阈值。观察到BN填料不会对材料的热机械性能产生负面影响，并允许将TC从0提高。