Abstract The performance of chemical mechanical polishing (CMP) was determined by the morphological characteristics of the abrasive particle. In this study, the shape of the aggregate of fumed silica was confirmed by a method of characterizing the morphology of the particles using transmission electron microscopy (TEM). Each aggregate was classified into four types—linear, branched, ellipsoidal, and spheroidal—and the shape distribution of a fumed-silica slurry was investigated with different specific surface areas. The CMP performance of fumed silica slurries at 90 m2/g with numerous linear-shaped aggregates and 400 m2/g with the highest portion of spheroidal aggregates were compared to that of colloidal silica slurry. A model for the effects of bumpy abrasives on CMP explained the reason for this result by using penetration depth and MRR with various numbers of contact bumps. Furthermore, a mixture of spherical and non-spherical abrasives in a ratio of 4:1 exhibited an improved CMP performance.

中文翻译：

---

气相二氧化硅磨料的形状分类及其对化学机械抛光的影响

摘要 化学机械抛光（CMP）的性能由磨粒的形态特征决定。在这项研究中，气相二氧化硅聚集体的形状通过使用透射电子显微镜 (TEM) 表征颗粒形态的方法来确认。每种聚集体分为四种类型——线性、支链、椭圆体和球体——并研究了具有不同比表面积的气相二氧化硅浆料的形状分布。将 90 m2/g 的气相法二氧化硅浆料的 CMP 性能与大量线性聚集体和 400 m2/g 的球状聚集体的最高部分进行比较，与胶体二氧化硅浆料的 CMP 性能进行了比较。凹凸磨料对 CMP 的影响模型通过使用具有不同数量接触凸块的穿透深度和 MRR 解释了这一结果的原因。此外，比例为 4:1 的球形和非球形磨料的混合物表现出改进的 CMP 性能。