Abstract A parallel connection of electronic devices in the energy system is currently the only and the most effective way to expand the power capacity. For a circuit containing loads, a minor change of the conduction resistance of electronic devices is not suitable for measurement, but for each parallel branch, its change will be more obvious through current distribution. In this paper, we proposed a current-based method for condition monitoring of the aging process of the electronic modules. The aging information on the package is analyzed and calculated to quantifiable convert to its conduction resistance and then to the current distribution of each branch. By detecting and comparing the value of the current, the aging process can be monitored in real-time. The proposed method has the advantages of low cost and easy implementation. More in detail, it does not need for multi-point monitoring of case temperature, or complicated circuit design for minor changes in voltage monitoring. Finally, the accuracy of the proposed method is validated by simulations and experimental results show a good agreement. Index Terms IGBT, Condition monitoring, Aging process, Parallel connection.

中文翻译：

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一种并联IGBT模块的实时老化监测方法

摘要 能源系统中的电子设备并联是目前唯一也是最有效的扩大电力容量的方式。对于包含负载的电路，电子器件导通电阻的微小变化不适合测量，但对于每个并联支路，通过电流分布其变化会更加明显。在本文中，我们提出了一种基于电流的电子模块老化过程状态监测方法。对封装上的老化信息进行分析计算，可量化转换为其导通电阻，进而转换为各支路的电流分布。通过检测和比较电流值，可以实时监测老化过程。所提出的方法具有成本低、易于实施的优点。更详细地说，它不需要外壳温度的多点监控，也不需要复杂的电路设计来监控电压的微小变化。最后，通过仿真验证了所提出方法的准确性，实验结果表明了良好的一致性。索引术语 IGBT，状态监测，老化过程，并联。