Standard physical vapor deposition systems are large, expensive, and slow. As part of an on-going effort to build a fab-on-a-chip, we have developed a chip-scale, low cost, fast physical vapor deposition system designed to be used with atomic calligraphy or dynamic stencil lithography to direct write nanostructures. The system comprises two MEMS devices: a chip-scale thermal evaporator and a mass sensor that serves as a film thickness monitor. Here, we demonstrate the functionality of both devices by depositing Pb thin-films. The thermal evaporator was made by fabless manufacturing using the SOIMUMPs processs (MEMSCAP, inc). It turns on in 1:46 s and reaches deposition rates as high as 7.2Å s−1 with ~1 mm separation from the target. The mass sensor is a re-purposed quartz oscillator (JTX210) that is commercially available for less than one dollar. Its resolution was measured to be 2.65 fg or 7.79E-5 monolayers of Pb. [2020-0237]

中文翻译：

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芯片级、低成本 PVD ​​系统

标准的物理气相沉积系统大、昂贵且速度慢。作为构建片上晶圆厂的持续努力的一部分，我们开发了一种芯片级、低成本、快速的物理气相沉积系统，旨在与原子书法或动态模板光刻一起使用以直接写入纳米结构. 该系统包括两个 MEMS 设备：一个芯片级热蒸发器和一个用作薄膜厚度监视器的质量传感器。在这里，我们通过沉积 Pb 薄膜来演示这两种设备的功能。热蒸发器是使用 SOIMUMPs 工艺 (MEMSCAP, inc) 通过无晶圆制造制造的。它在 1:46 s 内开启并达到高达 7.2Å s-1 的沉积速率，与目标的距离约为 1 mm。质量传感器是一种重新设计的石英振荡器 (JTX210)，市售价格不到一美元。其分辨率测量为 2.65 fg 或 7.79E-5 单层铅。[2020-0237]