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A plane stress model of bond-based Cosserat peridynamics and the effects of material parameters on crack patterns
Engineering Analysis With Boundary Elements ( IF 3.3 ) Pub Date : 2020-11-27 , DOI: 10.1016/j.enganabound.2020.11.011
Xianyang Guo , Zhuang Chen , Xihua Chu , Ji Wan

A plane stress model of bond-based Cosserat peridynamics is proposed, of which the constitutive equations of Cosserat continuum are implemented. The rotation of the proposed bond-based Cosserat peridynamic model is independent with the translational displacement, and the couple stress is considered in the material points’ interaction. The proposed model can degenerate into bond-based peridynamics and micropolar peridynamics under certain conditions. Several examples of crack propagation are designed to investigate the effect of material parameters on crack patterns. The numerical results are compared with other peridynamic models and experimental results to validate the proposed model. The numerical results show that the Cosserat shear modulus and the tangential stiffness of bond have an impact on crack propagation, including crack branching and crack pattern.



中文翻译:

基于键的Cosserat绕动力学的平面应力模型以及材料参数对裂纹模式的影响

提出了基于键的Cosserat绕动力学的平面应力模型,并实现了Cosserat连续体的本构方程。所提出的基于键的Cosserat绕动力学模型的旋转与平移位移无关,并且在材料点的相互作用中考虑了耦合应力。所提出的模型在某些条件下可以退化为基于键的动力学和微极动力学。设计了裂纹扩展的几个示例,以研究材料参数对裂纹图案的影响。将数值结果与其他周边动力学模型和实验结果进行比较,以验证所提出的模型。数值结果表明,Cosserat剪切模量和粘结的切向刚度对裂纹扩展有影响,

更新日期:2020-11-27
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