V‐shaped thermal actuators are popular in many types of microelectromechanical systems' (MEMS) devices. In the rapidly growing applications of V‐shaped thermal actuators, there are usually complex driven structures, in which the Joule heat may transfer, connecting to the V‐beams. However, their influence on the temperature distribution has not been included in existing analytical models. An electro‐thermo‐mechanical model is presented to tackle this problem. By dividing the thermal actuator into a set of short beams, a two‐dimensional network is constructed. Besides, the driven structure can be analyzed as an equivalent circuit of thermal resistances. Then, circuit‐like node equations can be acquired for this heat flow network to solve the heat distribution. On this basis, the heat expansions of the shuttle beam are taken into consideration to predict the displacements and forces under different driving voltage and ambient temperature. Taking a test structure as an example, this model is proved to be accurate by comparing the results with finite element analysis. This model can be served as an effective analysis technique for MEMS devices containing V‐shaped thermal actuators.

中文翻译：

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用于分析与从动结构相连的V形热执行器的高效电热力学模型

V型热执行器在许多类型的微机电系统（MEMS）设备中很流行。在V型热执行器的快速增长的应用中，通常存在复杂的从动结构，焦耳热可能在其中传递并连接到V形梁。但是，它们对温度分布的影响尚未包含在现有的分析模型中。为了解决这个问题，提出了一种电热机械模型。通过将热执行器分成一组短梁，可以构建二维网络。此外，可以将驱动结构分析为热阻的等效电路。然后，可以为该热流网络获取类似电路的节点方程，以求解热分布。以这个为基础，考虑到往复梁的热膨胀，以预测在不同驱动电压和环境温度下的位移和力。以测试结构为例，通过将结果与有限元分析进行比较，证明该模型是准确的。该模型可以用作包含V型热致动器的MEMS器件的有效分析技术。