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High Performance and Near Body Temperature Induced Self-Healing Thermoplastic Polyurethane Based on Dynamic Disulfide and Hydrogen Bonds
Polymer ( IF 4.1 ) Pub Date : 2020-11-26 , DOI: 10.1016/j.polymer.2020.123261
Haohao Wu , Xiangdong Liu , Dekun Sheng , Yan Zhou , Shaobin Xu , Haopu Xie , Xinxin Tian , Yinglu Sun , Biru Shi , Yuming Yang

It is necessary to develop polymer materials with excellent mechanical properties and can be quickly repaired under reasonable conditions. However, it is difficult to simultaneously optimize the mechanical properties and repair conditions as they have conflicting realization requirements. In this study, we prepare a thermoplastic polyurethane (I-4-P-HM) containing two kinds of alicyclic isocyanate with a tensile strength and toughness of 11.35 MPa and 64.1 MJ m-3, respectively. The mechanical properties of the cut and spliced I-4-P-HM films can be completely restored to their original values at near body temperature (40 °C) in only two hours. In I-4-P-HM, isophorone diisocyanate (IPDI) directly connect to aromatic disulfide that enables a more efficient exchange of the aromatic disulfides, while dicyclohexylmethane 4,4'-diisocyanate (HMDI) with a symmetrical alicyclic structure endows the TPU with better mechanical properties. The two work together to make polyurethane have good mechanical properties and can be repaired quickly under mild condition. Furthermore, we carried out the scratch recovery experiments on I-4-P-HM covered with a layer of conductive silver paste, and the results indicate that this TPU has the potential to be applied in the flexible electronics industry.



中文翻译:

基于动态二硫键和氢键的高性能和近体温诱导的自修复热塑性聚氨酯

有必要开发具有优异机械性能并且可以在合理条件下快速修复的聚合物材料。但是,由于它们的实现要求相互矛盾,因此难以同时优化机械性能和维修条件。在本研究中,我们制备了一种热塑性聚氨酯(I-4-P-HM),其中包含两种脂环族异氰酸酯,其拉伸强度和韧性分别为11.35 MPa和64.1 MJ m -3, 分别。剪切和拼接的I-4-P-HM膜的机械性能仅在两个小时内即可在接近体温(40°C)的情况下完全恢复到其原始值。在I-4-P-HM中,异佛尔酮二异氰酸酯(IPDI)直接连接到芳族二硫化物上,从而可以更有效地交换芳族二硫化物,而具有对称脂环结构的二环己基甲烷4,4'-二异氰酸酯(HMDI)使TPU具有更好的机械性能。两者共同作用使聚氨酯具有良好的机械性能,并且可以在温和的条件下快速修复。此外,我们在覆盖有一层导电银浆的I-4-P-HM上进行了划痕恢复实验,结果表明该TPU具有在柔性电子行业中应用的潜力。

更新日期:2020-11-27
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