Microencapsulated phase change materials (MicroPCM) were prepared via sol–gel method using paraffin as heat storage core and silica as inorganic shell. The morphology feature, chemical structure, thermal properties and thermal stability of MicroPCM were characterized by the field emission scanning electron microscope (FE-SEM), Fourier transform infrared spectroscopy (FTIR), the differential scanning calorimeter (DSC), simultaneous thermal analyzer (STA) and the thermal conductivity meter. The results indicated that MicroPCM were spherical in shape with the shell thickness in the range from 236[Formula: see text]nm to 303[Formula: see text]nm. The stirring speed and TEOS dosage were key factor on the latent heat and supercool effect of MicroPCM. The maximum latent heat of MicroPCM was 240.2[Formula: see text][Formula: see text] with the heat loss of only 0.2[Formula: see text][Formula: see text] in phase transformation when it was prepared at the stirring speed of 400[Formula: see text]r/min and TEOS dosage of 20[Formula: see text]ml. MicroPCM was a promising material for thermal energy storage (TES).

中文翻译：

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溶胶-凝胶法制备高潜热低热损失石蜡芯SiO2微囊相变材料及其性能

以石蜡为蓄热核、二氧化硅为无机壳，采用溶胶-凝胶法制备微囊相变材料（MicroPCM）。利用场发射扫描电子显微镜（FE-SEM）、傅里叶变换红外光谱（FTIR）、差示扫描量热仪（DSC）、同步热分析仪（STA）对MicroPCM的形貌特征、化学结构、热性能和热稳定性进行了表征。 ) 和热导率计。结果表明，MicroPCM呈球形，壳层厚度在236[公式：见正文]nm到303[公式：见正文]nm之间。搅拌速度和TEOS用量是影响MicroPCM潜热和过冷效应的关键因素。MicroPCM的最大潜热为240.2[公式：见正文][公式：见文]热损失仅为0.2[公式：见文][公式：见文]搅拌速度为400[公式：见文]r/min，TEOS用量为20[配方：见正文]ml。MicroPCM 是一种很有前途的热能存储 (TES) 材料。