A cooling system composed of a thermal redistribution layer (TRDL) and a thermal through‐silicon via (TTSV) is proposed for three‐dimensional integrated circuits (3D ICs). According to the Fourier heat flow analysis theory, the heat flow model of the proposed cooling system is established and verified by finite element analysis (FEA). It is shown that the maximum error between the heat flow model and FEA is 2.98%, and the maximum temperature of 3D ICs can be reduced by 4.43°C. The established horizontal heat dissipation channel can effectively solve the heat dissipation problem in 3D ICs.

中文翻译：

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热重分布层在3D IC冷却中的有效性

提出了一种由热重分布层（TRDL）和热硅通孔（TTSV）组成的冷却系统，用于三维集成电路（3D IC）。根据傅立叶热流分析理论，建立了所提出的冷却系统的热流模型，并通过有限元分析（FEA）进行了验证。结果表明，热流模型与FEA之间的最大误差为2.98％，并且3D IC的最高温度可以降低4.43°C。建立的水平散热通道可以有效解决3D IC的散热问题。