Abstract The flexible heat dissipation material with high thermal conductivity and electrical insulation is ideal for highly integrated flexible electronic devices. In this study, the flexible polymer composite films were prepared by spin coating process, the thermal conductivity and electrical insulation of the composite film are significantly enhanced by adding short carbon fibers (SCF) and boron nitride (BN) particles to PDMS matrix. SCF and BN particles construct an effective thermal conduction path in the PDMS matrix, while highly insulating BN particles inhibit the formation of conductive paths. The thermal conductivity of 15%SCF/20%BN/PDMS film achieved 2.29 W/m·K when 15 wt% SCF and 20 wt% BN were loaded, which was 990% enhancement compared to pure PDMS. And its volume electrical resistivity and breakdown strength reached 2.11 × 1014 Ω·cm and 12.5 KV/mm respectively, showing excellent electrical insulation property.

中文翻译：

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SCF/BN/PDMS复合材料的高导热和电绝缘柔性薄膜

摘要 具有高导热性和电绝缘性的柔性散热材料是高度集成的柔性电子器件的理想材料。本研究采用旋涂工艺制备柔性聚合物复合薄膜，在PDMS基体中加入短碳纤维（SCF）和氮化硼（BN）颗粒，显着提高了复合薄膜的导热性和电绝缘性。SCF 和 BN 颗粒在 PDMS 基质中构建了有效的热传导路径，而高度绝缘的 BN 颗粒抑制了传导路径的形成。当负载15 wt% SCF和20 wt% BN时，15%SCF/20%BN/PDMS薄膜的热导率达到2.29 W/m·K，与纯PDMS相比提高了990%。其体积电阻率和击穿强度均达到2。