Silicon Photonics Technology using sub micrometer SOI platform, which commercially emerged at the beginning of the century, has now gained market shares in the field of fiber optic interconnects, from Inter-to Intra-Data Center communications. With growing demands in terms of aggregated bandwidth, scalability, transceiver form factor, and cost, Silicon Photonics is expected to play a growing role, especially with the foreseeable need to co-package photonic transceivers with next generation Ethernet switches. This new paradigm will be possible only with an evolution of existing Silicon Photonics manufacturing platforms, in order to solve the challenges of 3D packaging, laser integration, reflow-compatible optical connectors and high efficiency, low footprint modulators. Achieving these challenges may pave the way to Terabit scale communications in Data Centers and High Performance Computing Systems (HPC).

使用亚微米SOI平台的Silicon Photonics Technology于20世纪初开始出现，现已在光纤互连领域（从内部到数据中心通信）中赢得了市场份额。随着对聚合带宽，可伸缩性，收发器形状因数和成本的需求不断增长，Silicon Photonics有望发挥越来越大的作用，尤其是在可预见的将光子收发器与下一代以太网交换机共同封装的需求中。为了解决3D封装，激光集成，回流兼容的光学连接器以及高效，低占位面积调制器的挑战，只有在现有的Silicon Photonics制造平台不断发展的情况下，这种新的范例才有可能实现。