Recent progress in portable semiconductor and thermocatalytic gas sensors requires the development of the microhotplates with reduced power consumption, increased shock resistance, and low resistance drift. Rh is known as alloying component, which allows one to decrease the diffusion mobility of Pt in bulk resistive heating elements. Here, a comparison study on the stability of microhotplates based on Pt and Pt-Rh thin films is performed. The porous anodic alumina is used as a substrate, which provides high adhesion of the metal film and the thermal expansion coefficient compatible with Pt and Pt-Rh alloys. Morphology and crystal structure of metal films are studied after recrystallization annealing in air at the temperatures 600–810 °C. To simulate thermal effects of the microhotplates, a model based on the finite element method is developed. The perspectives of Pt-11 % Rh alloy as a material for microhotplates operating at the temperatures above 500 °C are discussed. The achieved characteristics of the fabricated Pt-Rh microhotplates on porous anodic alumina substrates allow one to use them as a universal platform for semiconductor and thermocatalytic gas sensors manufacturing.

便携式半导体和热催化气体传感器的最新进展要求开发具有降低的功耗，增加的耐冲击性和低电阻漂移的微热板。Rh被称为合金成分，它可以降低Pt在体电阻加热元件中的扩散迁移率。在此，对基于Pt和Pt-Rh薄膜的微热板的稳定性进行了比较研究。多孔阳极氧化铝用作基材，可提供金属膜的高附着力以及与Pt和Pt-Rh合金兼容的热膨胀系数。在空气中在600–810°C的温度下进行重结晶退火后，研究了金属膜的形貌和晶体结构。为了模拟微热板的热效应，建立了基于有限元方法的模型。讨论了Pt-11％Rh合金作为在500°C以上的温度下运行的微热板的材料的观点。在多孔阳极氧化铝基板上制造的Pt-Rh微热板的已实现特性使人们可以将其用作半导体和热催化气体传感器制造的通用平台。