Abstract Electronic components have changed the way we live and the way we use technology since they were first introduced into products. Most equipment is only as reliable as its internal electronic components. In electronic integrated circuit (IC) components, wire bonding is the most common first-level interconnection method between die and lead. Failure of wire bonds can have very costly consequences in the severe or harsh operating conditions of the oil and gas industry, where services such as rig charge are extremely expensive. Wire bonding has several failure modes and mechanisms. The most common failure modes are ball bond failure due to intermetallic growth and stress, wire rupture due to electrical overstress, and stitch-bond related failures due to repeated flexure of the wire induced by thermomechanical loading. The ball and stitch-bond failures are accelerated in harsh environment applications. This study focuses on gold (Au) and copper (Cu) stitch-bond failures caused by mechanical vibration coupled with thermal cycling of gull-wing plastic components. Both design and operating parameters impact stitch-bond reliability. In this study, simulation was used first to identify the potential effect of design parameters (component level and assembly level) on the stress magnitude and to rank the most critical structural parameters impacting stitch-bond reliability. Test units were designed based on the simulations and subjected to the test conditions that provided feedback to the model to define acceptance criteria using experimental results. Destructive construction analysis confirmed the location of stitch-bond failures and variables contributing to early failure or extended life of stitch bonds. This paper describes the component robustness prediction method that can be used as a lot acceptance test to screen plastic encapsulated IC components using construction analysis.

中文翻译：

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基于结构分析的缝焊可靠性评估

摘要 电子元件自首次被引入产品以来，已经改变了我们的生活方式和使用技术的方式。大多数设备的可靠性取决于其内部电子元件。在电子集成电路 (IC) 元件中，引线键合是裸片和引线之间最常见的一级互连方法。在石油和天然气行业的严酷或恶劣的操作条件下，引线键合失败可能会产生非常昂贵的后果，其中钻机费用等服务极其昂贵。引线键合有几种失效模式和机制。最常见的失效模式是由于金属间化合物生长和应力引起的球焊失效、由于电应力过大引起的导线断裂以及由于热机械负载引起的导线反复弯曲引起的缝焊相关失效。在恶劣的环境应用中，球和缝焊故障会加速。这项研究的重点是由机械振动和鸥翼塑料部件的热循环引起的金 (Au) 和铜 (Cu) 缝纫故障。设计和操作参数都会影响缝编的可靠性。在这项研究中，首先使用仿真来确定设计参数（组件级别和装配级别）对应力大小的潜在影响，并对影响缝焊可靠性的最关键结构参数进行排序。测试单元是基于模拟设计的，并经受测试条件，这些测试条件向模型提供反馈，以使用实验结果定义验收标准。破坏性结构分析确认了缝焊失效的位置和导致缝焊早期失效或延长寿命的变量。本文介绍了可用作批量验收测试的组件稳健性预测方法，以使用构造分析筛选塑料封装的 IC 组件。