Nano-sized silicon carbide (SiC: 0wt%, 1wt%, 2wt%, 4wt%, and 8wt%) reinforced copper (Cu) matrix nanocomposites were manufactured, pressed, and sintered at 775 and 875°C in an argon atmosphere. X-ray diffraction (XRD) and scanning electron microscopy were performed to characterize the microstructural evolution. The density, thermal expansion, mechanical, and electrical properties were studied. XRD analyses showed that with increasing SiC content, the microstrain and dislocation density increased, while the crystal size decreased. The coefficient of thermal expansion (CTE) of the nanocomposites was less than that of the Cu matrix. The improvement in the CTE with increasing sintering temperature may be because of densification of the microstructure. Moreover, the mechanical properties of these nanocomposites showed noticeable enhancements with the addition of SiC and sintering temperatures, where the microhardness and apparent strengthening efficiency of nanocomposites containing 8wt% SiC and sintered at 875°C were 958.7 MPa and 1.07 vol%^-1, respectively. The electrical conductivity of the sample slightly decreased with additional SiC and increased with sintering temperature. The prepared Cu/SiC nanocomposites possessed good electrical conductivity, high thermal stability, and excellent mechanical properties.

纳米尺寸的碳化硅（SiC：0wt％，1wt％，2wt％，4wt％和8wt％）增强的铜（Cu）基纳米复合材料在氩气中于775和875°C下制造，压制和烧结。进行了X射线衍射（XRD）和扫描电子显微镜以表征微观结构的演变。研究了密度，热膨胀，机械和电性能。XRD分析表明，随着SiC含量的增加，显微应变和位错密度增加，而晶体尺寸减小。纳米复合材料的热膨胀系数（CTE）小于铜基体的热膨胀系数。随着烧结温度的升高，CTE的提高可能是由于微观结构的致密化。此外，^-1。样品的电导率随SiC的增加而略有下降，随烧结温度的升高而增加。制备的Cu / SiC纳米复合材料具有良好的导电性，高的热稳定性和优异的机械性能。