当前位置: X-MOL 学术IEEE Trans. Compon. Packag. Manuf. Technol. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Foreword: Special Section on Electrical Performance for Highly Integrated Systems
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2020-11-18 , DOI: 10.1109/tcpmt.2020.3035950
Pascal Xavier

Not a day goes by without the issue of global warming and the depletion of the planet’s resources being addressed in the media. And it is clear that the societal and environmental challenges posed are of considerable magnitude because we all must drastically reduce our carbon footprint. At the same time, the amount of data exchanged around the world is constantly increasing. Do we need to be reminded once again of the extent to which our global data infrastructures have made it possible, and are still making it possible, to fight the COVID-19 pandemic with all the necessary strength?

中文翻译:

前言:高度集成系统的电气性能特别部分

没有一天,没有全球变暖的问题和媒体对地球资源枯竭的关注。显然,所造成的社会和环境挑战是巨大的,因为我们所有人都必须大大减少我们的碳足迹。同时,全球交换的数据量也在不断增加。是否需要再次提醒我们,全球数据基础架构在多大程度上已经并仍在使之有可能以所有必要的力量与COVID-19大流行作斗争?
更新日期:2020-11-21
down
wechat
bug