An arbitrary power divider (PD), which can be fully integrated on a multilayered printed circuit board (PCB), is presented without using the surface-mounted device (SMD) resistors. In the proposed SMD-resistor-free isolation network, a new multiple microstrip gap-coupled resonators (MM-GCRs) is designed in an FR4 substrate based on an optimization algorithm to achieve an equivalent grounded resistor in the desired frequency band. Consequently, the acquired output matching and isolation bandwidths are designable and much wider than that of other existing SMD-resistor-free PDs with both output matching and isolation characteristics. To verify it, the design of PCB-based SMD-resistor-free PDs with the power division ratio being 1–3 is given. For all fabricated PDs, the measured input return loss and extra insertion loss are, respectively, better than 20 dB and less than 0.52 dB, respectively, at the operating frequency. In addition, the measured output return loss and isolation loss are better than 15 dB from 2.4 to 2.5 GHz. Moreover, the measured output matching and isolation bandwidths are, respectively, 8 and 3.5 times wider than that of other existing SMD-resistor-free PD with both output matching and isolation characteristics. Since the proposed PD is synthesized based on distributed elements without using any SMD resistor, the proposed PD thus possesses the advantages of being suitable for system-on-package (SoP), cost-efficient, suitable for millimeter-wave (mm-Wave) application, and capable to be fully integrated on a multilayered PCB.

中文翻译：

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采用新型 SMD 无电阻隔离网络在印刷电路板上完全集成任意功率分配器


提出了一种无需使用表面贴装器件（SMD）电阻器即可完全集成在多层印刷电路板（PCB）上的任意功率分配器（PD）。在所提出的无 SMD 电阻隔离网络中，基于优化算法在 FR4 基板中设计了一种新型多微带间隙耦合谐振器 (MM-GCR)，以在所需频段实现等效接地电阻。因此，所获得的输出匹配和隔离带宽是可设计的，并且比现有的其他具有输出匹配和隔离特性的无SMD电阻的PD要宽得多。为了验证这一点，给出了功率分配比为1-3的基于PCB的SMD无电阻PD的设计。对于所有制造的 PD，在工作频率下测得的输入回波损耗和额外插入损耗分别优于 20 dB 和小于 0.52 dB。此外，在 2.4 至 2.5 GHz 范围内测得的输出回波损耗和隔离损耗优于 15 dB。此外，测得的输出匹配和隔离带宽分别比现有其他兼具输出匹配和隔离特性的无SMD电阻PD宽8倍和3.5倍。由于所提出的PD是基于分布式元件合成的，而不使用任何SMD电阻器，因此所提出的PD具有适合系统级封装（SoP）、成本效益高、适合毫米波（mm-Wave）的优点应用，并且能够完全集成在多层PCB上。