This article presents the design, simulation, and fabrication of printed microstrip transmission line (TL) and microwave ring resonators using aerosol-jet printing for system-in-package applications. The printed TLs are 8 mm long and their S-parameters are measured over a wide bandwidth ranging from 1 to 26 GHz. Their insertion loss ranges between 0.02 dB/mm at 1 GHz and 0.56 dB/mm at 26 GHz. Ring resonators were designed and printed to operate at center frequencies of 15.5, 17.5, 19.5, and 21.5 GHz by tuning the size of the ring. Variability studies are carried out to evaluate the ability of the printing process to fabricate reproducible devices. The coupling gap is optimized in order to minimize the insertion loss in the ring resonators without compromising $Q$ -factor. The simulations show good agreement with the experimental results. The ability to print both conductors as well as dielectrics for the fabrication of microwave resonators demonstrate the potential for in-package integration of RF resonators for low-cost sensor applications.

中文翻译：

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用于系统级封装应用的气溶胶喷射印刷的微波微带环形谐振器

本文介绍了用于系统级封装应用的使用气溶胶喷射印刷技术的印刷微带传输线（TL）和微波环形谐振器的设计，仿真和制造。印刷的TL长8毫米，其S参数在1至26 GHz的宽带宽内测量。它们的插入损耗范围在1 GHz时为0.02 dB / mm至26 GHz时为0.56 dB / mm。通过调整环的大小，设计并打印出环形谐振器，使其在15.5、17.5、19.5和21.5 GHz的中心频率下工作。进行了可变性研究，以评估印刷工艺制造可复制设备的能力。优化了耦合间隙，以便在不影响环形谐振器插入损耗的情况下将其最小化 $ Q $ -因子。仿真结果与实验结果吻合良好。同时印刷导体和电介质以制造微波谐振器的能力证明了在低成本传感器应用中射频谐振器的封装内集成潜力。