The silicon carbide whose surface had been modified by laser cladding silicon layer was soldered by borosilicate glass. And the borosilicate glass solder had a thermal expansion coefficient similar to that of the silicon carbide substrate. The laser cladding silicon layer significantly improved the wettability between molten glass solder and silicon carbide and could reduce the soldering temperature. A sandwich-like joining structure (SiC/Si/solder/Si/SiC) was made after the borosilicate glass slurry put on the laser cladding silicon layers. The microstructure, compositions, and interfacial properties were studied. Results showed that good adhesion between silicon carbide and the glass soldering layer was achieved. The flexural strength of the connection structure prepared at 900 °C in the air reached 110 MPa. This research provides an effective technical solution for realizing local heat treatment soldering of large silicon carbide components.

用硼硅酸盐玻璃焊接表面已被激光熔覆硅层改性的碳化硅。硼硅玻璃焊料的热膨胀系数与碳化硅衬底的相似。激光熔覆硅层显着提高了熔融玻璃焊料与碳化硅之间的润湿性，并可以降低焊接温度。在将硼硅酸盐玻璃浆料置于激光熔覆硅层上之后，制成三明治状的接合结构（SiC / Si / solder / Si / SiC）。研究了显微组织，组成和界面性质。结果表明，碳化硅与玻璃焊接层之间具有良好的粘合性。在900°C的空气中制备的连接结构的抗弯强度达到110 MPa。