The two important parameters, to evaluate the performance of the photon sieves quantitatively, are the intensity and resolution at the focus plane. Both high-intensity and super-resolution depend on the ratio of the diameter (d) of each pinhole to the width (w) of the related Fresnel zone: the d/w ratio. The size deviations in the produced pinholes may adversely affect the optical performance of the photon sieves. The mispositioned and imperfectly-shaped pinholes cause the super-resolution at the focus to be disrupted. The photon sieves are produced by using two sub-methods of maskless lithography: lift-off and wet chemical etching. Although designed to be constant of 1, the d/w ratio was measured to widen gradually for both chemical-etched and lift-off samples. It is revealed the optical performance of the photon sieves may be enhanced as a result of gradual increase of the d/w ratio, compared to the structure of constant d/w ratio.

中文翻译：

---

d/w 比逐渐加宽对两种无掩模光刻技术产生的光子筛光学性能的影响：剥离和化学蚀刻

定量评估光子筛性能的两个重要参数是焦平面处的强度和分辨率。高强度和超分辨率都取决于每个针孔的直径 (d) 与相关菲涅耳区的宽度 (w) 的比率：d/w 比率。产生的针孔的尺寸偏差可能会对光子筛的光学性能产生不利影响。错位和形状不完美的针孔导致焦点处的超分辨率被破坏。光子筛是通过使用两种无掩模光刻的子方法产生的：剥离和湿化学蚀刻。尽管设计为常数 1，但测量到化学蚀刻和剥离样品的 d/w 比逐渐变宽。