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Heat transfer enhancements in heat pipe constructed with a copper porous microstructure
International Journal of Green Energy ( IF 3.1 ) Pub Date : 2020-11-16 , DOI: 10.1080/15435075.2020.1847114
Yang Dong Ling 1 , Shuichi Torii 1
Affiliation  

ABSTRACT

This paper aims to measure heat transfer performance in heat pipe cooling device under constant heat flux condition. Emphasis is placed on a surface modification of heat pipe to enhance heat transfer performance. The surface fabricated here is coated by hydrogen codeposition of copper electrodeposits to modify the surface’s porosity and roughness. It is found that thermal resistance for the coated surface is suppressed to 16% as compared to the uncoated surface, that is, the surface modification results in attenuation on heat pipe’s thermal resistance, especially for low heat flux. This characteristic, by an electron microscope, is explained as the formation of the rough inner surface in heat pipe which supports higher heat transfer as compared to the uncoated surface.



中文翻译:

具有铜多孔微结构的热管中的传热增强

摘要

本文旨在测量在恒定热通量条件下热管冷却装置的传热性能。重点放在热管的表面改性上,以提高传热性能。此处制造的表面通过铜电沉积的氢共沉积进行涂覆,以改变表面的孔隙率和粗糙度。已经发现,与未涂覆的表面相比,涂覆表面的热阻被抑制到16%,即,表面改性导致热管的热阻的衰减,特别是对于低热通量。用电子显微镜将该特性解释为热管中粗糙的内表面的形成,与未涂覆的表面相比,该内表面支持更高的热传递。

更新日期:2020-12-28
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