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Fabrication of SiC concave microlens array mold based on microspheres self-assembly
Microelectronic Engineering ( IF 2.6 ) Pub Date : 2021-02-01 , DOI: 10.1016/j.mee.2020.111481
Ruzhen Xu , Tianfeng Zhou , Rebecca Cheung

Abstract Microlens array (MLA) is applied widely in imaging, lighting, and sensing fields. Among the many techniques for MLA fabrication, molding is considered to be a mass-production method with low-cost and good accuracy. Silicon carbide (SiC), which has a high mechanical hardness, high thermal conductivity, and low thermal expansion coefficient, is an ideal mold material. But to fabricate microlens array on SiC by the mechanical method is a challenging issue because of its high brittleness and hardness. In this study, a novel method is proposed and developed, in which we use self-assembled silica microspheres monolayer as a template for SU8 resist patterning, subsequently producing concave MLAs in the SiC substrates by Inductively Coupled Plasma (ICP) etching. Two sizes of hexagonal MLAs (diameter Φ11 μm and height 0.8 μm, diameter Φ33 μm and height 2.9 μm, respectively) have been created and tested to possess good imaging performance.

中文翻译:

基于微球自组装的 SiC 凹面微透镜阵列模具的制作

摘要 微透镜阵列(MLA)广泛应用于成像、照明和传感领域。在 MLA 制造的众多技术中,成型被认为是一种成本低、精度好的批量生产方法。碳化硅(SiC)具有高机械硬度、高导热性和低热膨胀系数,是一种理想的模具材料。但由于碳化硅的脆性和硬度高,通过机械方法在碳化硅上制造微透镜阵列是一个具有挑战性的问题。在这项研究中,提出并开发了一种新方法,其中我们使用自组装二氧化硅微球单层作为 SU8 抗蚀剂图案化的模板,随后通过电感耦合等离子体 (ICP) 蚀刻在 SiC 衬底中产生凹面 MLA。两种尺寸的六边形 MLA(直径 Φ11 μm 和高度 0.8 μm,
更新日期:2021-02-01
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