Abstract A photosensitive ladder-structured polysilsesquioxane was synthesized for the development of flexible copper clad laminates through electroless plating of Cu. The developed ladder-structured polysilsesquioxane with controlled structure enabled easy introduction of protected thiol and allyl functional group, which under acidic conditions, the thiol group becomes deprotected. This deprotected thiol group enables UV-initiated thiol-ene curing of the exposed regions, while the unexposed regions containing free thiol groups act as seed initiators for Cu electroless plating, and the corresponding negative pattern fabrication process also possible. Through this facile method, we were able to develop flexible copper clad laminates of tunable Cu interconnect width size of high electrical conductivity according to photomask pattern and the insulating dielectric surrounding layer exhibiting low dielectric constant and low loss behavior without any corrosive Cu etching steps.

中文翻译：

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用于柔性覆铜板免蚀刻加工的光敏杂化聚倍半硅氧烷

摘要 合成了一种光敏梯状结构聚倍半硅氧烷，用于通过化学镀铜开发柔性覆铜板。所开发的具有可控结构的梯形结构聚倍半硅氧烷可以轻松引入受保护的硫醇和烯丙基官能团，在酸性条件下，硫醇基团会脱保护。这种脱保护的硫醇基团能够使暴露区域的紫外线引发硫醇烯固化，而含有游离硫醇基团的未暴露区域作为 Cu 化学镀的种子引发剂，相应的负图案制造工艺也是可能的。通过这种简便的方法，