当前位置: X-MOL 学术Journal of Theoretical and Applied Mechanics › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Effect of environmental conditioning on pure mode I fracture behaviour of adhesively bonded joints
Theoretical and Applied Fracture Mechanics ( IF 5.0 ) Pub Date : 2020-12-01 , DOI: 10.1016/j.tafmec.2020.102826
S. Abdel-Monsef , J. Renart , L. Carreras , P. Maimí , A. Turon

Abstract The influence of different harsh environmental conditions on the fracture behaviour of secondary bonded adhesive joints is experimentally investigated using mode I DCB tests. Two types of adhesively bonded joints under wet-aged and non-aged conditions were tested at three temperatures: -55°C, room temperature and 80°C. The wet-aged specimens were exposed to accelerated ageing in an environmental chamber at 70°C/85% RH for four years; meanwhile, the non-aged specimens were stored in the laboratory under controlled conditions at room temperature. It was observed that extremely long ageing time has a significant effect on the fracture response of the bonded joint, while the temperature increase is holding a slight impact. Freezing temperature leads to more brittle behaviour and a reduction in the fracture toughness.

中文翻译:

环境条件对胶接接头纯 I 型断裂行为的影响

摘要 使用模式 I DCB 试验研究了不同恶劣环境条件对二次粘合胶接接头断裂行为的影响。在三种温度下测试了湿老化和非老化条件下的两种胶粘接头:-55°C、室温和 80°C。湿老化样品在环境试验箱中在 70°C/85% RH 下加速老化四年;同时,未老化的样品在室温下在受控条件下储存在实验室中。观察到极长的时效时间对接合接头的断裂响应有显着影响,而温度升高则保持轻微影响。冷冻温度导致更脆的行为和断裂韧性的降低。
更新日期:2020-12-01
down
wechat
bug