当前位置: X-MOL 学术J. Membr. Sci. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Addition of modified hollow mesoporous organosilica in anhydrous SPEEK/IL composite membrane enhances its proton conductivity
Journal of Membrane Science ( IF 8.4 ) Pub Date : 2021-02-01 , DOI: 10.1016/j.memsci.2020.118897
Zhun Li , Zhifu Guan , Chunyang Wang , Bo Quan , Lianhua Zhao

Abstract Sulfonated hollow mesoporous organosilica (sHMO) was successfully prepared. SP/IL/sHMO-x (x = 2.5, 5.0, 7.5 and 10 wt%) composite membrane was synthesized by dispersing ionic liquid (IL) in sHMO, with sulfonated polyether ether ketone (SPEEK, SP) as the matrix. For comparison, unsulfonated HMO and SP/IL/HMO-x membranes were also prepared. The membranes were characterized by Fourier transform infrared spectroscopy (FT-IR), thermogravimetric (TG) analysis, dipping and AC impedance. FT-IR results showed no new chemical bond was formed among SPEEK, IL and organosilica, and the components were bound by intermolecular hydrogen bonding. The results of TG showed that the membranes were stable up to 240 °C. The IL loss study showed that the retention of IL increased with the increase of the content of organosilica, while sHMO composite membrane showed lower IL retention capacity than HMO composite membrane. Proton conductivity study showed that sHMO also contributed to the conductivity of the membrane. The conductivity of the SP/IL-30/sHMO-7.5membrane was 1.13 mS cm−1 at 200 °C, which is twice that of the SP/IL-30/HMO-7.5 (0.60 mS cm−1). At 200 °C, the conductivity of SPEEK/IL-50/sHMO-7.5 reached 10.5 mS cm−1. The anhydrous composite membrane could be used in PEMFCs under medium temperature condition.

中文翻译:

在无水SPEEK/IL复合膜中加入改性中空介孔有机硅增强其质子传导性

摘要 成功制备了磺化中空介孔有机硅(sHMO)。SP/IL/sHMO-x (x = 2.5, 5.0, 7.5 and 10 wt%)复合膜是通过将离子液体(IL)分散在sHMO中,以磺化聚醚醚酮(SPEEK, SP)为基质合成的。为了比较,还制备了未磺化的 HMO 和 SP/IL/HMO-x 膜。通过傅里叶变换红外光谱 (FT-IR)、热重 (TG) 分析、浸渍和交流阻抗对膜进行表征。FT-IR结果表明SPEEK、IL和有机硅之间没有形成新的化学键,各组分之间通过分子间氢键结合。TG 的结果表明该膜在高达 240 °C 时是稳定的。IL损失研究表明,随着有机硅含量的增加,IL的保留增加,而 sHMO 复合膜的 IL 截留能力低于 HMO 复合膜。质子电导率研究表明 sHMO 也有助于膜的电导率。SP/IL-30/sHMO-7.5 膜在 200 °C 时的电导率为 1.13 mS cm-1,是 SP/IL-30/HMO-7.5 (0.60 mS cm-1) 的两倍。在 200 °C 时,SPEEK/IL-50/sHMO-7.5 的电导率达到 10.5 mS cm-1。该无水复合膜可用于中温条件下的PEMFCs。5 毫秒 cm−1。该无水复合膜可用于中温条件下的PEMFCs。5 毫秒 cm−1。该无水复合膜可用于中温条件下的PEMFCs。
更新日期:2021-02-01
down
wechat
bug