Abstract Electrically conductive adhesives (ECAs) are starting to replace metallic solders in recent designs of photovoltaic (PV) modules. This transition represents a significant material change, and a proper understanding of the durability and reliability of the new interconnect needs to be established. This paper presents our continued work on developing a degradation model for ECA interconnects in PV modules. Here, we characterize the fracture mechanics properties of an epoxy–based ECA, for both critical and subcritical, mode I and mode II loading conditions. Emphasis is on the influence of different environmental conditions such as temperature and humidity. We use the Finite Element Method to account for residual stresses, induced by temperature changes and moisture absorption, and correct the apparent fracture toughness. We found that high moisture levels not only can weaken the fracture resistance of the ECA interconnect, but can also promote subcritical debonding at significantly lower driving forces than in dry environments.

中文翻译：

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环境对导电胶开裂和脱粘的影响

摘要 在最近的光伏 (PV) 模块设计中，导电粘合剂 (ECA) 开始取代金属焊料。这种转变代表了重大的材料变化，需要建立对新互连的耐用性和可靠性的正确理解。本文介绍了我们在开发光伏组件中 ECA 互连退化模型方面的持续工作。在这里，我们表征了环氧基 ECA 在临界和亚临界、I 型和 II 型加载条件下的断裂力学性能。重点是温度和湿度等不同环境条件的影响。我们使用有限元方法来考虑由温度变化和吸湿引起的残余应力，并校正表观断裂韧性。