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Improvements of Corrosion Resistance and Antibacterial Properties of Hydroxyapatite/Cupric Oxide Doped Titania Composite Coatings on Degradable Magnesium Alloys
Langmuir ( IF 3.7 ) Pub Date : 2020-11-10 , DOI: 10.1021/acs.langmuir.0c02442 Yingchao Xu 1 , Tianxiao Wang 1 , Yunting Guo 1 , Guangyu Li 1 , Jianshe Lian 1
Langmuir ( IF 3.7 ) Pub Date : 2020-11-10 , DOI: 10.1021/acs.langmuir.0c02442 Yingchao Xu 1 , Tianxiao Wang 1 , Yunting Guo 1 , Guangyu Li 1 , Jianshe Lian 1
Affiliation
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The excellent biocompatibility of calcium phosphate (CaP) coatings makes them widely used in magnesium (Mg) alloy orthopedic implant materials. However, the porous morphology of CaP coatings limits their corrosion resistance. A cupric oxide (CuO) doped titania (TiO2) sol–gel coating is prepared on a porous hydroxyapatite (HA) coating. According to electrochemical test results, the HA/CuO–TiO2 coating obtains a current density of 6 × 10–4 mA/cm2, lower than that of the Mg alloy (2.6 × 10–2 mA/cm2). The hydrogen evaluation of the HA/CuO–TiO2 coating is only 1/12 that of the Mg alloy after immersion for 7 days. In addition, the HA/CuO–TiO2 coating has an antibacterial rate of 99.5 ± 0.4% against Staphylococcus aureus, significantly higher than that of the HA coating (19.8 ± 0.3%) and HTC0 coating (38.4 ± 0.5%). The CuO doped composite coating has no adverse effect or cytotoxicity on cell proliferation (cell viability ≥79.6%). Hence, the HA/CuO–TiO2 composite coating is useful for enhancing the corrosion resistance and antibacterial properties of Mg alloys while ensuring cytocompatibility. The HA/CuO–TiO2 coated AZ60 Mg alloy can meet the requirements of clinical application.
中文翻译：
降解镁合金上羟基磷灰石/氧化铜掺杂二氧化钛复合涂层的耐蚀性和抗菌性能的改进
磷酸钙（CaP）涂层具有出色的生物相容性，使其广泛用于镁（Mg）合金整形外科植入材料中。但是，CaP涂层的多孔形态限制了其耐腐蚀性。在多孔羟基磷灰石（HA）涂层上制备了氧化铜（CuO）掺杂的二氧化钛（TiO 2）溶胶-凝胶涂层。根据电化学测试结果，HA / CuO-TiO 2涂层的电流密度为6×10 –4 mA / cm 2，低于Mg合金的电流密度（2.6×10 –2 mA / cm 2）。浸泡7天后，HA / CuO-TiO 2涂层的氢评估仅为Mg合金的氢评估的1/12。另外，HA / CuO-TiO 2该涂层对金黄色葡萄球菌的抗菌率为99.5±0.4％，显着高于HA涂层（19.8±0.3％）和HTC0涂层（38.4±0.5％）。CuO掺杂的复合涂层对细胞增殖没有不利影响或细胞毒性（细胞活力≥79.6％）。因此，HA / CuO-TiO 2复合涂层可用于增强镁合金的耐蚀性和抗菌性能，同时确保其细胞相容性。HA / CuO–TiO 2涂层的AZ60 Mg合金可以满足临床应用要求。
更新日期：2020-11-25
中文翻译：
降解镁合金上羟基磷灰石/氧化铜掺杂二氧化钛复合涂层的耐蚀性和抗菌性能的改进
磷酸钙（CaP）涂层具有出色的生物相容性，使其广泛用于镁（Mg）合金整形外科植入材料中。但是，CaP涂层的多孔形态限制了其耐腐蚀性。在多孔羟基磷灰石（HA）涂层上制备了氧化铜（CuO）掺杂的二氧化钛（TiO 2）溶胶-凝胶涂层。根据电化学测试结果，HA / CuO-TiO 2涂层的电流密度为6×10 –4 mA / cm 2，低于Mg合金的电流密度（2.6×10 –2 mA / cm 2）。浸泡7天后，HA / CuO-TiO 2涂层的氢评估仅为Mg合金的氢评估的1/12。另外，HA / CuO-TiO 2该涂层对金黄色葡萄球菌的抗菌率为99.5±0.4％，显着高于HA涂层（19.8±0.3％）和HTC0涂层（38.4±0.5％）。CuO掺杂的复合涂层对细胞增殖没有不利影响或细胞毒性（细胞活力≥79.6％）。因此，HA / CuO-TiO 2复合涂层可用于增强镁合金的耐蚀性和抗菌性能，同时确保其细胞相容性。HA / CuO–TiO 2涂层的AZ60 Mg合金可以满足临床应用要求。
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