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Noncovalent Modification of Boron Nitrite Nanosheets for Thermally Conductive, Mechanically Resilient Epoxy Nanocomposites
Industrial & Engineering Chemistry Research ( IF 3.8 ) Pub Date : 2020-11-10 , DOI: 10.1021/acs.iecr.0c03133 Qingshi Meng 1 , Sensen Han 1 , Tianqing Liu 2 , Jian Ma 3 , Shude Ji 1 , Jiabin Dai 4 , Hailan Kang 5 , Jun Ma 1, 4
Industrial & Engineering Chemistry Research ( IF 3.8 ) Pub Date : 2020-11-10 , DOI: 10.1021/acs.iecr.0c03133 Qingshi Meng 1 , Sensen Han 1 , Tianqing Liu 2 , Jian Ma 3 , Shude Ji 1 , Jiabin Dai 4 , Hailan Kang 5 , Jun Ma 1, 4
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Due to the rapid development of modern micro/nano electronic devices, polymer nanocomposites of high mechanical performance, and thermal conductivity and stability are increasingly important. We herein report a two-step process for preparation of ∼3 nm-thick boron nitride (BN) nanosheets through noncovalent modification by a surfactant Triton X-100, which improves the compatibility of the nanosheets with the matrix as well as their dispersion. TEM micrographs demonstrated that the modified BN nanosheets (m-BN) were relatively uniformly dispersed in epoxy matrix and some were connected with each other. At 2.14 vol % of m-BN, the glass-transition temperature (Tg) and adhesive toughness of neat epoxy were improved by 17% and 355%, respectively. At 4.93 vol %, the thermal conductivity of neat epoxy was remarkably increased to 0.65 W·m–1·k–1, an increment of 335%. In addition, the epoxy/m-BN nanocomposites exhibited high thermal stability, which holds a potential as thermal interface materials for the next generation of electronic devices.
中文翻译：
亚硝酸硼纳米片的非共价改性，用于导热，机械弹性环氧纳米复合材料
由于现代微/纳米电子设备的迅速发展，具有高机械性能以及导热性和稳定性的聚合物纳米复合材料变得越来越重要。我们在本文中报告了通过表面活性剂Triton X-100的非共价改性，制备约3 nm厚的氮化硼（BN）纳米片的两步过程，该工艺提高了纳米片与基质的相容性以及它们的分散性。TEM显微照片表明，改性的BN纳米片（m -BN）相对均匀地分散在环氧基质中，并且有些相互连接。在m -BN为2.14 vol％时，玻璃化转变温度（T g）和纯环氧树脂的粘合韧性分别提高了17％和355％。在4.93体积％时，纯环氧的导热率显着增加至0.65 W·m –1 ·k –1，增幅为335％。另外，环氧/ m -BN纳米复合材料表现出高的热稳定性，具有作为下一代电子设备的热界面材料的潜力。
更新日期：2020-11-25
中文翻译：
亚硝酸硼纳米片的非共价改性，用于导热，机械弹性环氧纳米复合材料
由于现代微/纳米电子设备的迅速发展，具有高机械性能以及导热性和稳定性的聚合物纳米复合材料变得越来越重要。我们在本文中报告了通过表面活性剂Triton X-100的非共价改性，制备约3 nm厚的氮化硼（BN）纳米片的两步过程，该工艺提高了纳米片与基质的相容性以及它们的分散性。TEM显微照片表明，改性的BN纳米片（m -BN）相对均匀地分散在环氧基质中，并且有些相互连接。在m -BN为2.14 vol％时，玻璃化转变温度（T g）和纯环氧树脂的粘合韧性分别提高了17％和355％。在4.93体积％时，纯环氧的导热率显着增加至0.65 W·m –1 ·k –1，增幅为335％。另外，环氧/ m -BN纳米复合材料表现出高的热稳定性，具有作为下一代电子设备的热界面材料的潜力。
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