ABSTRACT The objective of this research was to electrocodeposit turmeric particles into copper matrices, and assess the influence of turmeric on the microstructure and properties of those deposits. The incorporation of turmeric had a significant effect on both the grain structure and properties of the copper deposits, with turmeric particles of a Z-average size of 289 ± 30 and 278 ± 15 nm having a greater influence on grain refinement than particles of 134 ± 37 nm, even at much lower deposit particle contents. The incorporated turmeric increased both the hardness and water contact angle of the deposits; however, a reduction in resistance to salt spray corrosion was also observed.

中文翻译：

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姜黄对铜电沉积复合材料晶粒结构和性能的影响

摘要 本研究的目的是将姜黄颗粒电共沉积到铜基质中，并评估姜黄对这些沉积物的微观结构和性质的影响。姜黄的掺入对铜沉积物的晶粒结构和性质都有显着影响，Z 平均尺寸为 289 ± 30 和 278 ± 15 nm 的姜黄颗粒对晶粒细化的影响大于 134 ± 37 nm，即使沉积颗粒含量低得多。掺入的姜黄增加了沉积物的硬度和水接触角；然而，也观察到耐盐雾腐蚀的降低。