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Comparison of effects of simulated electric field interference and presence of a barrier in the nickel electroplating process to experimental data
Transactions of the IMF ( IF 1.2 ) Pub Date : 2020-11-01 , DOI: 10.1080/00202967.2020.1819021
S. M. J. S. Shourije 1 , M. E. Bahrololoom 1
Affiliation  

ABSTRACT Nickel coatings were electroplated galvanostatically under electric field interference condition and also under the presence of two different types and sizes of barriers in the electroplating bath. The electric field interference and the presence of a barrier during electroplating were simulated using COMSOL® software in order to investigate the effect of these phenomena on the coatings’ characteristics. Effect of electric field interference and the presence of a barrier on the coatings’ thickness, electric field lines and simulated potential of the electroplating process were also examined. The results showed that the coating thickness was decreased with electric field interference and the presence of a barrier. Various types of barriers, with differing electrical conductivities, had different effects on the coatings’ characteristics. Finally, simulation of these two processes showed that electric field interference can bend the electric field lines and change the coating thickness. Moreover, the presence of barriers can either disrupt or strengthen the electric field, depending on their electrical conductivities.

中文翻译:

镍电镀过程中模拟电场干扰和屏障存在的影响与实验数据的比较

摘要 在电场干扰条件下以及在电镀浴中存在两种不同类型和尺寸的屏障的情况下,镍涂层被电镀。使用 COMSOL® 软件模拟电镀过程中的电场干扰和屏障的存在,以研究这些现象对涂层特性的影响。还研究了电场干扰和屏障的存在对涂层厚度、电场线和电镀过程模拟电位的影响。结果表明,涂​​层厚度随着电场干扰和屏障的存在而降低。具有不同电导率的各种类型的屏障对涂层的特性有不同的影响。最后,对这两个过程的模拟表明,电场干扰可以使电场线弯曲并改变涂层厚度。此外,屏障的存在可以破坏或加强电场,这取决于它们的导电性。
更新日期:2020-11-01
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