This study demonstrates a method for the deposition of CuO_x thin films by combining atmospheric pressure plasma jet with spark discharge. In this type of discharge source, the bulk copper material of spark discharge electrodes plays the role of a precursor. Copper atoms and particles go through the physical processes of sputtering, evaporation, and further agglomeration and condensation in the plasma jet and on the substrate. The experiments were carried out with and without a combination of discharges. The material coated on the substrate was studied using a scanning electron microscope, Raman spectroscopy, and energy‐dispersive X‐ray spectroscopy. The characteristics of the set‐up and plasma, such as I‐V curves, optical emission spectra, and substrate temperature, were also measured. Copper electrodes were examined for erosion by a scanning electron microscope. The results demonstrate that deposits coated by combined discharge show denser and thicker films.

中文翻译：

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通过在大气压下将等离子流与火花放电源结合来进行薄膜沉积

这项研究表明了一种沉积CuO _x的方法通过将大气压等离子体射流与火花放电结合而形成薄膜。在这种类型的放电源中，火花放电电极的块状铜材料起着前驱物的作用。铜原子和粒子经过溅射，蒸发以及在等离子体射流中以及在基板上的进一步团聚和冷凝的物理过程。在有放电和无放电的情况下进行实验。使用扫描电子显微镜，拉曼光谱和能量色散X射线光谱研究了涂覆在基材上的材料。还测量了装置和等离子体的特性，例如I-V曲线，光发射光谱和基板温度。通过扫描电子显微镜检查铜电极的腐蚀。