Copper paste is considered as a promising candidate for printed electronics in replacement for silver paste. This is owing to copper which has anti-electromigration property, lower cost, and similar conductivity and compared with silver. We synthesize a copper nanoparticle (NP) paste that can be sintered at low temperature for high conductivity. The copper NP paste composes of 50 wt% copper NPs and dipropylene glycol (DPG) as the disperse medium. The effect of DPG coating and various conditions of milling with small beads on improving the dispersity of copper NPs has been investigated. The optimum conditions for milling are at 1000 and 2000 rpm for 30 min. This results in a volume resistivity of 6.62 × 10^-6 Ω·cm after sintering the copper NP paste at 200 °C.

铜浆被认为是替代银浆的印刷电子产品的有前途的候选人。这是由于与银相比，铜具有抗电迁移性能，较低的成本和类似的导电性。我们合成了可以在低温下烧结以获得高导电率的铜纳米粒子（NP）浆料。铜NP糊剂由50重量％的铜NP和作为分散介质的二丙二醇（DPG）组成。研究了DPG涂层和小球磨各种条件对改善铜纳米颗粒分散性的影响。研磨的最佳条件是在1000和2000 rpm下持续30分钟。在200°C下烧结铜NP浆料后，其体积电阻率为6.62×10 ^-6Ω ·cm。