In this paper, the Cu-2Ag sheet is prepared by the new process of upward method, and the alloy sheet was prepared by continuous cold rolling and thermomechanical treatment of solution aging. Through scanning electron microscopy, transmission electron microscopy, performance testing and other means, the effects of upward, rolling, solid solution, aging and other processes on the forming process of silver-copper alloy is systematically analyzed, so as their microstructure, mechanical properties and electrical properties. The results show that it is feasible to prepare the Cu-2Ag sheet by the upward method, which can meet the requirements of subsequent forming and use performance: Cu-2Ag has a dispersion precipitation effect, and a reasonable heat treatment process that can produce a large number of nano-level spherical silver-rich solid solutions uniformly dispersed in the copper matrix, thereby optimizing the properties of the alloy. After being treated by solution, it has the best performance under 450 Cנ48 h aging, with a hardness of 74.9 HV_0.2 and conductivity of 92.7% IACS.

本文采用向上的新方法制备了Cu-2Ag薄板，并通过连续冷轧和固溶时效的热机械处理制备了合金薄板。通过扫描电子显微镜，透射电子显微镜，性能测试等手段，系统地分析了向上，滚动，固溶，时效等工艺对银铜合金成形过程的影响，并对其组织，力学性能和力学性能进行了研究。电性能。结果表明，采用向上法制备Cu-2Ag片材是可行的，可以满足后续成型和使用性能的要求：Cu-2Ag具有分散沉淀作用，合理的热处理工艺可以产生大量均匀分散在铜基体中的纳米级球形富银固溶体，从而优化了合金的性能。固溶处理后，在450 Cנ48 h时效下具有最佳性能，硬度为74.9 HV_0.2和电导率为92.7％IACS。