Abstract The purpose of this paper is to assess thermal management and optimization of several parameters such as: materials, size and thickness of all subcomponents of single-chip Light Emitting Diode (LED) in order to minimize its junction temperature and thereby maximizing light output and device reliability. For this, we developed a three-dimensional code using Comsol Multiphysics that solves the systems of equations for the mass, momentum and energy. After validation of this numerical 3D code, the thermal Characterization of Subcomponents of LED system is studied numerically. This system is divided into 6 parts such as: metallization, die, die-attach, substrate, Thermal Interface Material and heat sink. Several materials which can be used in each part of the LED package from metallization to the heat sink are studied. By moving to one part to another, it was selected the best materials always allowing a minimum junction temperature.

中文翻译：

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方形发光二极管子元件的三维热分析与优化

摘要 本文的目的是评估几个参数的热管理和优化，例如：单芯片发光二极管 (LED) 的所有子组件的材料、尺寸和厚度，以最大限度地降低其结温，从而最大限度地提高光输出和设备可靠性。为此，我们使用 Comsol Multiphysics 开发了一个三维代码，用于求解质量、动量和能量方程组。在验证此数字 3D 代码后，对 LED 系统子组件的热特性进行了数值研究。该系统分为 6 个部分，例如：金属化、芯片、芯片连接、基板、热界面材料和散热器。研究了可用于从金属化到散热器的 LED 封装每个部分的几种材料。