In this work, the dielectric properties of modified lignocellulosic biodegradable coir fibers were studied. Modifications comprise of transesterification with butyl acrylate (BA) and subsequent curing with benzoyl peroxide (BPO), that remove the cementing materials resulting in a decrease in the dielectric constant (K) and the dissipation factor (Df). The decrease in K of the modified coirs (MCs) is due to its enhanced hydrophobicity. Removal of cementing materials favor the formation of uniform holes/pores in the MCs resulting in large number of interfaces, subsequently these interfaces restrain the motion of charges, which decreases the Df values. It is established that removal of the cementing materials i.e. lignin from the parent coir (PC) lead to better dielectric materials. The hydrophobicity, resistance power to chemical damage, crystallinity, tensile strength and thermal stability increases respectively for MCs in comparison to PC except the Zeta potential which decreases. More importantly, the sintering temperature can go as high as 500 \(^\circ C\) or more for MCs, which are suitable for integrated circuit design lithography process. These biodegradable coir fibers due to their higher packing density, thermal stability and insulating properties could be very important materials for embedded capacitors, different electronic devices and microelectronics applications.

Graphic Abstract

中文翻译：

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低Df的可生物降解的基于椰壳的多层多孔纤维素介电材料在绝缘材料中的应用

在这项工作中，研究了改性木质纤维素可生物降解椰壳纤维的介电性能。改性包括用丙烯酸丁酯（BA）进行酯交换反应和随后用过氧化苯甲酰（BPO）进行固化，这些方法除去了胶结材料，从而导致介电常数（K）和耗散因数（Df）降低。K的减少改性椰壳纤维（MCs）的改性是由于其增强的疏水性。去除胶结材料有利于在MC中形成均匀的孔/孔，从而导致大量的界面，随后这些界面会限制电荷的运动，从而降低Df值。已经确定，从母体椰壳（PC）中除去胶结材料，即木质素，可以得到更好的介电材料。与MC相比，MC的疏水性，对化学损伤的抵抗力，结晶度，拉伸强度和热稳定性与PC相比分别增加，除了Zeta电势降低。更重要的是，烧结温度可以高达500  \（^ \ circ C \）或更多的MC，适用于集成电路设计光刻工艺。这些可生物降解的椰壳纤维由于具有较高的堆积密度，热稳定性和绝缘性能，因此对于嵌入式电容器，不同的电子设备和微电子应用而言，可能是非常重要的材料。

图形摘要